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Five major trends in the future development of SMT placement machines

Release time:2020-08-05 15:20:20  Views: 223

   The future development direction of the placement machine: high-efficiency two-way conveying structure

   In order to increase production efficiency faster and reduce working time, the new type placement machine is developing in the direction of high-efficiency two-way conveying structure. On the basis of retaining the performance of the traditional single-path placement machine, the dual-path conveyor placement machine designs the PCB's transportation, positioning, detection, placement, etc. into a dual-path structure. The working mode of this two-way structure placement machine can be divided into synchronous mode and asynchronous mode. The synchronous method is to send two PCBs of different sizes to the mounting area synchronously from a dual track for mounting, and the asynchronous method is to send PCBs of different sizes to the mounting area respectively. Both of these two working methods can shorten the effective working time and improve the production efficiency of the machine.

The placement machine's future development direction 2: high-speed, high-precision, multi-function, intelligent placement machine placement efficiency, accuracy and placement function are contradictory, the new type placement machine is striving for high-speed, high-precision, Multifunctional development. Because of the continuous development of surface mount components (SMC/SMD), the packaging format is also constantly adjusted. New packages, such as BGA, FC, CSP, etc., have higher and higher requirements for placement machines. In order to improve placement efficiency, Meihefa's placement machine adopts "flight inspection" technology. The placement head sucks the chip while running while detecting, so as to improve the placement efficiency of the placement machine. Deutsche Siemens has introduced intelligent control on its new placement machine, so that the placement machine has a low error rate while maintaining a high production capacity. There are FC Vision modules and Flux Dispenser on the machine to meet the needs of FC placement. . Japan's Yamaha company has introduced a dual-group rotating placement head in the newly launched YV88X model, which not only improves the placement efficiency of integrated circuits, but also ensures better placement accuracy.

  The future development direction of the placement machine three: multiple cantilever, multiple placement head

In the traditional arch-type placement machine, there is only a cantilever and a placement head, which can no longer meet the demand for efficiency in modern production. For this reason, people have developed a double cantilever placement machine based on a single cantilever placement machine. For example, GSM2 of Universal Instruments, S25 of Siemens, etc., the two placement heads alternately paste the same PCB, which doubles the production efficiency under the condition of not adjusting the floor space of the machine. In order to improve production efficiency, people have introduced four-cantilever machines on the basis of double-cantilever machines, such as Siemens HS60, Universal Instruments GC120, Panasonic CM602, Hitachi GHX-1, etc., all of which are currently the mainstream high-speed stickers on the market. Tablet models. Multi-cantilever machines have taken the place of turret machines and become the mainstream trend in the development of high-speed placement machines in the future.

  The future development direction of the placement machine four: flexible connection, modularization

  The new placement machine is developing towards a flexible placement system and a modular structure in order to enhance adaptability and use efficiency. Japan's Fuji company changed the traditional concept and divided the placement machine into a control host and a functional module machine. According to the different needs of users, the control host and the functional module machine were flexibly combined to meet the needs of users. Modular machines have different functions. According to the mounting requirements of different components, they can be mounted with different accuracy and efficiency to achieve higher efficiency; when users have new requirements, they can add new functions as needed Modular machine. Because it can flexibly add different types of placement units according to future needs to meet future flexible production needs, this kind of modular structure machine is very popular with customers. When the work is adjusted, it is very important to be able to improve the work adaptability of the equipment in time. Important, because new packaging and circuit boards have brought new requirements. Investment in Taiwan placement equipment should often be based on current considerations and estimates of future demand. Purchasing equipment with much more features than currently required can often avoid business opportunities that may be missed in the future. It is more economically more cost-effective to upgrade on existing equipment than to buy new equipment.

Another development direction of modularity is the functional module components. The specific table is currently: the host of the placement machine is made into standard equipment, and equipped with a unified standard base platform and a common user interface; The function is made into a functional module component, and the user can install the required functional module component on the host or replace with a new component according to the needs, so as to realize the new functional requirement required by the user. For example, in the placement machine of Universal Instruments, when the functions from dispensing to placement are exchanged, only the dispensing component and the placement component need to be exchanged. This equipment is suitable for processing companies with multiple tasks, multiple users, and short production cycles.

  The future development direction of the placement machine five: with automatic programming

In order to target very special components, new vision software tools should have the ability to automatically "learn". Users do not need to manually input parameters into the system and create device descriptions from scratch. They only need to take the device to the vision camera and take a photo. , The system will automatically generate a comprehensive description similar to CAD. This technology can improve the accuracy of device descriptions, reduce many operator errors, and speed up the creation of component libraries, especially when new devices are frequently introduced or shape-specific devices are used, thereby improving production efficiency.